U.S. Senator Todd Young (R-Ind.) led a letter signed by the full Indiana congressional delegation in support of the application submitted by SK hynix for funding through the U.S. Department of Commerce’s CHIPS Incentives Program Notice of Funding Opportunity for Commercial Fabrication Facilities.

In April, SK hynix – the world’s leading producer of high-bandwidth memory chips – announced plans to invest an estimated $3.8 billion to build an advanced chip packaging fabrication and R&D facility in West Lafayette. This facility will be the first of its kind in the United States.

The proposal would help ensure Indiana’s leadership in semiconductor manufacturing and artificial intelligence.

“SK hynix’s project, which will create up to 1,000 jobs by 2030, represents a significant step toward the continued development of a Silicon Heartland in the Midwest. Through SK hynix’s partnerships with Purdue University and Ivy Tech Community College, Indiana will further grow a robust talent pipeline as training programs and curricula are developed to enable students to attain the skills needed for semiconductor manufacturing.

“SK hynix’s investment will help the U.S. to reestablish its leadership in semiconductor technology and represents a significant step in developing a robust, U.S.-based semiconductor ecosystem,” the Indiana delegation wrote in its support letter. 

In addition to Senator Young, the letter was signed by Senator Mike Braun and Representatives Jim Baird, Frank Mrvan, Rudy Yakym, Jim Banks, Victoria Spartz, Greg Pence, André Carson, Larry Bucshon, and Erin Houchin.

The full delegation support letter is available here.

Senator Young first introduced the legislation that became the CHIPS and Science Act in 2020. After years of work, it was signed into law in 2022. Since then, Indiana has received a string of investments sparked by the law, including SK hynix’s investment, which is the largest economic investment in the Indiana’s history.